Inslogic PC (Polycarbonate) Filament is an engineering-grade material, compatible with FDM 3D printers using 1.75 mm diameter filament with a precision of ±0.03 mm.

PC is a robust thermoplastic 3D printing filament known for its excellent impact resistance, high stiffness, and heat resistance. This makes it capable of absorbing impact, preventing deformation or cracks, and maintaining stability even under high temperatures. With a heat resistance of up to 101 °C, PC performs admirably in high-temperature environments. Its remarkable impact strength makes it a popular choice for producing rigid parts, function testing, and manufacturing.

Inslogic PC filament, a robust thermoplastic material, is suitable for a wide range of everyday applications. Its combination of good electrical insulation and heat resistance makes it ideal for lighting, electrical, and electronic equipment, including 3D printed circuit boards, extension cords, and lampshades.

PC absorbs moisture from the air as it is a hygroscopic material. It is advisable to dry it before use and store it in an airtight container when not in use.